Product Brief
ORCA Series 4
January 15, 2002
Field-Programmable Gate Arrays
Ordering Information
OR4Exx –1 BM 680
DEVICE TYPE
SPEED GRADE
TEMPERATURE RANGE
NUMBER OF PINS
PACKAGE TYPE
5-6435 (F).l
OR4Exx, –1 Speed Grade, 680-pin Plastic Ball Grid Array Multilayer (PBGAM)
Table 2. Device Type Options
Device
OR4Exx
Voltage
1.5 V internal
3.3 V/2.5 V/1.8 V/1.5 V I/O
Table 3. Temperature Options
Symbol
Description
Ambient Temperature
(Blank)
Industrial
–40 ? C to +85 ? C
Note: Device junction temperature of –40 ? C to +125 ? C are recommended.
Table 4. Package Options
Symbol
Description
BA
Plastic Ball Grid Array (PBGA)
BC
Enhanced Ball Grid Array (EBGA)
BM
Plastic Ball Grid Array, Multilayer (PBGAM)
Table 5. ORCA OR4EXX Series Package Matrix (Speed Grade)
Devices
256-Pin
FSBGA(BA)
352-Pin 416-Pin 432-Pin 680-Pin
PBGA(BA) PBGAM(BA) EBGA(BC) PBGAM(BM)
OR4E2
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3
OR4E4
–1, –2, –3
–1, –2, –3
–1, –2, –3
–1, –2, –3
OR4E6
–1, –2, –3
–1, –2, –3
–1, –2, –3
Lattice Semiconductor
5
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